Voyantic Webinar 8 February, 17.00 CET: Achieving Excellence in RAIN RFID IC Attach Process
The first step in the RAIN RFID smart label production process is to attach the RAIN IC (chip) to an antenna, creating an RFID inlay. Two components coming together - How hard can it be?
All the pioneers know just how difficult it used to be, but fortunately, technology has tremendously improved over the past 10 years. The IC attach process still includes numerous process variables that have an impact on the quality and performance of the inlay. The die size also continues to shrink, adding high-precision requirements for the manufacturing process. Achieving excellence in this industry requires multidiscipline expertise and close collaboration between IC, ACP, and machine vendors.
In this webinar, our guest speakers from Impinj and Delo present an overview of the IC attach process, the variables affecting the inlay quality, and how IC manufacturing recipes can be used in the production process. We will also cover the main aspects of inline process monitoring and quality control.
Topics include:
- Introduction to smart label manufacturing process
- IC attach process
- Challenge: numerous process variables
- Solution: IC manufacturing recipes
- Process monitoring
- Q&A
If you have a question you would like to be covered in the webinar, please send your question in advance to marketing@voyantic.com.
Panelists
- James Guzzo, SVP of Silicon Engineering, Impinj
- Hannes Jehle, Product Manager, DELO
- Juho Partanen, VP of Industrial Partnerships, Voyantic